3d finite element modeling comsol multiphysics Search Results


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COMSOL Inc 3d modeling comsol multiphysics v4.3a
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COMSOL Inc 1d, 2d, and 3d capacitive sensors
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
1d, 2d, And 3d Capacitive Sensors, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
Simplified 3d Model In Comsol Multiphysics V 4.3, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
3d Biphasic Finite Element Code Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 3d structural mechanics linear elastic comsol multiphysics 5.3 model
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
3d Structural Mechanics Linear Elastic Comsol Multiphysics 5.3 Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 3d finite element analysis comsol multiphysics 5.6
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
3d Finite Element Analysis Comsol Multiphysics 5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc time-dependent three-dimensional finite-element-method (3d-fem) simulations comsol multiphysics
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
Time Dependent Three Dimensional Finite Element Method (3d Fem) Simulations Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 3d finite element model using comsol multiphysics 6.0 software
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
3d Finite Element Model Using Comsol Multiphysics 6.0 Software, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc finite element 3-d multiphysics different module
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
Finite Element 3 D Multiphysics Different Module, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 3d full-field finite element optical simulations comsol multiphysics
Three Capacitive sensor structures and the electric field distributions in; ( a <t>)</t> <t>1D</t> coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) <t>3D</t> PPC.
3d Full Field Finite Element Optical Simulations Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 3d heat transfer model comsol multiphysics v5.6
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
3d Heat Transfer Model Comsol Multiphysics V5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Inc 4.3 multiphysics 3d model
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
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Image Search Results


Three Capacitive sensor structures and the electric field distributions in; ( a ) 1D coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) 3D PPC.

Journal: Micromachines

Article Title: Comparative Study and Simulation of Capacitive Sensors in Microfluidic Channels for Sensitive Red Blood Cell Detection

doi: 10.3390/mi13101654

Figure Lengend Snippet: Three Capacitive sensor structures and the electric field distributions in; ( a ) 1D coplanar interdigital capacitor (IDC), ( b ) 2D parallel plate capacitor (PPC), ( c ) 3D PPC.

Article Snippet: The detection sensitivities of 1D, 2D, and 3D capacitive sensors were determined by simulation using COMSOL Multiphysics ® v5.5.

Techniques:

Design parameters of capacitive sensor structures in 25 μm microfluidic channel; ( a ) 1D coplanar IDC, ( b ) 2D PPC, ( c ) L-shape 3D PPC, ( d ) Ω-shape 3D PPC.

Journal: Micromachines

Article Title: Comparative Study and Simulation of Capacitive Sensors in Microfluidic Channels for Sensitive Red Blood Cell Detection

doi: 10.3390/mi13101654

Figure Lengend Snippet: Design parameters of capacitive sensor structures in 25 μm microfluidic channel; ( a ) 1D coplanar IDC, ( b ) 2D PPC, ( c ) L-shape 3D PPC, ( d ) Ω-shape 3D PPC.

Article Snippet: The detection sensitivities of 1D, 2D, and 3D capacitive sensors were determined by simulation using COMSOL Multiphysics ® v5.5.

Techniques:

Initial capacitances (C init ) of the  1D  and  2D/3D  designs.

Journal: Micromachines

Article Title: Comparative Study and Simulation of Capacitive Sensors in Microfluidic Channels for Sensitive Red Blood Cell Detection

doi: 10.3390/mi13101654

Figure Lengend Snippet: Initial capacitances (C init ) of the 1D and 2D/3D designs.

Article Snippet: The detection sensitivities of 1D, 2D, and 3D capacitive sensors were determined by simulation using COMSOL Multiphysics ® v5.5.

Techniques:

(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) Multiphysics software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.

Journal: ACS Applied Materials & Interfaces

Article Title: Invisible Thermoplasmonic Indium Tin Oxide Nanoparticle Ink for Anti-counterfeiting Applications

doi: 10.1021/acsami.2c10864

Figure Lengend Snippet: (a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) Multiphysics software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.

Article Snippet: We implemented a 3D heat transfer model in COMSOL Multiphysics v5.6 in order to investigate the achievable thermal resolution as a function of substrate thickness and exposure time.

Techniques: Irradiation, Software